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MEMS Differential Pressure Sensor Wafer with Pressure Range 0~±100kPa/500kP
NSP1830 series MEMS differential pressure sensor wafer is mainly made via the piezoresistive effect of silicon with NOVOSENSE independent R&D MEMS micro machining process design. The sensor wafer manufacturing platform is qualified by IATF16949, and the front/back side of every wafer pass AOI tested which compiles with AEC-Q103 standards. This series of MEMS wafers can realize differential pressure detection, which can be widely used in automotive electronics, medical electronics, white household appliances and industrial control fields.
Product Features
• Operating temperature range: -40℃~125℃
• Pressure range: 0kPa~±100kPa/±500kPa
• The accuracy and stability in the life cycle are better than 1%F.S.
• Automotive-qualified IATF16949-certified process platform
• Comply with RoHS & REACH and halogen-free requirements
• Compiles with AEC-Q103 standard
• Single chip size: 1.8mmx1.8mmx0.4mm
Application
• Automotive: VBS vacuum boosting system sensor, EGR system differential pressure detection, Crankcase ventilation pressure sensor
• Industrial: pressure switch, negative pressure vacuum detection, gas flow monitoring
• Medical: ventilator, sphygmomanometer, oxygen generator, anesthesia apparatus, biosafety cabinet
• Home appliances: coffee machine, vacuum cleaner, water purifier, vacuum juicer, etc
• Consumption: air mattress, massage chair, air pump etc.
Functional Block Diagram
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